Process Overview
Technologies Roadmap
Process Selection
Mixed/CDMOS
BiCMOS
Logic
High voltage
Mask ROM
Embedded NVM

 Mixed/CDMOS

Technology

Vdd(V)

Poly Layer

Metal layer

Well/Sub

Process code

Status

0.35µm mixed

3-5

2

4

T/P

6S035DPQM-TTXX

Production

0.5µm mixed

3-5&1.5

2

3

T/P

6S05DPTM-STXX

Production

0.5µm HV mixed

25/40

2

3

Triple/P

6S05DPTM-ST20

Production

0.5µm 15V BCDMOS

5/15

15/15 

2

3

Triple/P

6S05DPTM

Production

0.5µm 25V BCDMOS

5/25

25/25

2

3

Triple/P

6S05DPTM

Production

0.6µm mixed

3-5

2

2

T/P

6S06DPDM-CTXX

Production

0.8µm mixed

3-5

2

2

T/P

6S08DPDM-CTXX

Production

 

 BiCMOS

Technology

Vdd(V)

Poly Layer

Metal layer

Well/Sub

Process code

Status

0.6µm BiCMOS

3.3/5

2

2

T/P

6S06DPDM-BCXX

Production

 

 Logic

Technology

Vdd(V)

Poly Layer

Metal layer

Well/Sub

Process code

Status

0.35µm logic

3-5

1

4

T/P

6S035SPQM-TT10

Production

0.5µm logic

3-5&1.5

1

3

T/P

6S05SPTM-STXX

Production

0.6µm logic

3-5&1.5

1

2

T/P

6S06SPDM-CTXX

Production

0.8µm logic

3-5&1.5

1

2

T/P

6S08SPDM-CTXX

Production

1.0µm MGLV

3-5&1.5

X

1

N/P

6S10MGLV-CP01

Production

1.2µm logic

3-5

1

2

N/P

6S12SPDM-CNXX

Production

1.5µm logic

3-5

1

2

N/P

6S15SPDM-CNXX

Production

1.5µm logic

3-5

1

2

P/N

6S15SPDM-CPXX

Production

3.0µm MGLV

3-5&1.5

X

1

P/N

6S30MGLV-CP05

Production

 

 High voltage

Technology

Vdd(V)

Poly Layer

Metal layer

Well/Sub

Process code

Status

0.5µm 18V

18

2

2

T/P

6S05DPDM-TT09

Production

0.6µm 18V

18

2

2

T/P

6S06DPDM-CT08

Production

0.6µm -30V

-30

1

2

Triple/P

6S06SPDM-CT12

Production

1.5µm 9V

9

2

2

T/P

6S15DPDM-CN10

Production

1.5µm 30V

30

1

2

N/P

6S15SPDM-CNXX

Production

1.5µm -30V

-30

1

2

P/N

6S15SPDM-CPXX

Production

3.0µm 12V

12

2

2

N/P

6S30SPDM-CNXX

Production

6.0µm MGHV

12

X

1

N/P

6S60MGHV

Production

 

 Mask ROM

Technology

Vdd(V)

Poly Layer

Metal layer

Well/Sub

Process code

Status

0.35µm flatcell

3-5

1

2

T/P

6S035SPDM-TT03

Production

0.4µm flatcell

3-5&1.5

1

2

T/P

6S04SPDM-CT03

Production

0.45µm flatcell

3-5

1

1

T/P

6S045SPSM-CT03

Production

 
 Embedded NVM

Technology

Vdd(V)

Poly Layer

Metal layer

Well/Sub

Process code

Status

0.6µm EEPROM

 

2

2

 

6C06DPDM-ECXX

Production

1.5µm EEPROM

 

2

2

 

6S15DPDM-ECXX

Production

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