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Quality Policy |
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CSMC aims to be a leading analog foundry in China by providing better quality, cost effective services, and a broad range of process technologies to fabless design houses and IDMs. | |
| CUSTOMER SATISAFCTION is our responsibility |
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 We are committed to providing our customers with quality service, direct support, superb
product value, efficient production, and prompt delivery.
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We are proud of our comprehensive customer feedback system. Aside from regular communications on
quality, we periodically make use of customer satisfaction surveys to help us evaluate and improve our
services. |
ZERO DEFECT is our target |
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We rely on stringent training to enable ourselves to do things right the first time. Every operator at CSMC has been trained and certified before performing duties. A monthly on-the-job examination system has helped improve our performance towards the goal of zero defect. |
CONTINUOUS IMPROVEMENT is our policy |
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Employees at every level are encouraged and challenged to continually increase the efficiency and effectiveness of their work. CSMC Fab 1 was awarded ISO/TS16949 certification which demonstrates CSMC's ability to meet the more demanding automotive-quality requirements. We are always striving for excellence in all aspects of our businesses. | |
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Quality Management |
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CSMC persists in a customer-oriented approach and has integrated all the quality standards at every stage of process development through mass production. CSMC emphasizes preventive system and process control. We have introduced zero defect methodology, and require every employee to continuously and diligently improve their daily work.
To ensure quality service, CSMC has built a Quality & Reliability System as follows:
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System Certificates
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Certificate |
Fab 1 |
Certified Organization |
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Certified Date |
Expire Date |
 Quality system |
| ISO 9002:1994 |
Aug. 1999 |
Sep. 2008 |
DNV |
| ISO9001:2008(download) |
Sep. 2004 |
Feb. 2012 |
DNV |
| Quality system for automotive suppliers |
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QS-9000:1998 |
Aug. 1999 |
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DNV |
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TS16949:2009(download) |
May. 2006 |
Jan. 2012 |
DNV |
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| Qualification/Reliability |
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In accordance with the JEDEC Standard, CSMC has installed a qualification system at the process level using accelerated stressing and testing to monitor the process development and find the elements that impact reliability. It primarily addresses technology wear mechanisms through package or wafer level reliability tests on specially designed test structures. |
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We have built a qualification and monitoring system for all technologies, including qualification tests at various stages of process development and in-line process monitoring at mass production. The CSMC Quality Management System enables us to provide better services to our customers. |
| Qualification of process technology |
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Test Items |
Test Method |
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Gate oxide integrity(Vbd, Qbd, TDDB) |
JESD35, JP001 |
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Hot carrier injection |
JESD28 |
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Vt stability |
JP001 |
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Electro-migration |
JESD87 |
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Stress-migration |
JEP139, JESD87 |
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Junction spiking |
CSMC method |
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HV transistor stability test |
CSMC method | |
| Process Monitoring |
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Test Items |
Test Method |
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Gate oxide integrity(Qbd) |
JESD35, JP001 |
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Hot carrier injection |
JESD28 |
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Vt stability |
JP001 |
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Electro-migration |
JESD61 |
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Bonding |
MIL-STD-883 |
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Passivation |
MIL-STD-883 | |
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Qualification/Reliability |
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In the semiconductor industry, thorough failure analysis is a vital tool for the development of new processes and the improvement of existing ones. CSMC has adopted many approaches to analyzing the root causes of failure and eliminating the failure mechanism. We endeavor to deliver reliable, top-quality service to our customers. | |
| Failure Analysis Items: |
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 Fast HR imaging
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IC topography analysis |
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IC Decapsulation and deprocessing analysis |
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Microstructure analysis |
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Elemental analysis |
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PVC (Passive Voltage Contrast) imaging analysis |
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PEM (Photon Emission Microscopy) analysis |
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Available for backside EMMI analysis |
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FMI (Fluorescent Micro-thermal Imaging) analysis |
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LC (Liquid Crystals) analysis |
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SRP (Spreading Resistance Profiling) analysis | |
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Failure Analysis Equipments:
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FA Item |
Current Equipment |
Model |
Capability |
Equipment Photo |
| Failure Site Isolation |
EMMI/backside EMMI |
IC Diagnostics |
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| Fluorescent Micro-thermal Imaging |
FMI-1100 |
0.001 0.3um |
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ASAP (Auto-Selected Area Preparation) |
ASAP-1 |
Space Resolution:1mm |
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| Liquid Crystal |
Wentworth PML8000 Keithley 4200 |
Space Resolution:1um |
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| Laser Mark |
Laser Cutter |
Ezlase II |
Limitation: Leakage>1mA |
| Electrical Characterization |
Probing /Tester |
Wentworth PML8000 Keithley 4200 |
Resolution: 0.1fA |
| SRP |
Spreading Resistance Profilin |
SSM2000 |
Junction>0.15um |
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| Die Exposure |
DECAP |
Nisene JET ETCH |
Decapsulate them plastic and BGA package |
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| Deprocessing |
RIE |
OXFORD 80PLUS |
Remove dielectric layer by layer |
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| Cross-section Analysis |
Micro-cleaving |
SELA MC600 |
Space resolution:  0.5um |
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| Polisher |
BULLER, OMNLAP 2000 |
SEM sample preparation by parallel lapping |
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| PECS |
Gatan 682 |
Provide excellent contrast of cross section |
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| Inspection Techniques |
Optical Microscope |
Olympus, LEICA |
Mag: 1000 |
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| Inspection Techniques & Element Analysis |
SEM
EDS |
HITACHI S4700/ HITACHI S4200
HORIBA EX350/OXFORD ISIS |
Resolution:1.5nm at 10kv
Resolution :1.6nm at 15kv |
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