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Company Profile |
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| Founder and Chairman of CSMC:Dr. Peter Chen |
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"We have US technology, Taiwan entrepreneurship and
operational expertise, backed by international capital. Place these
within the cost structure and market opportunity in China now and
we've got an unstoppable formula."
"Our success? I'd say we are there at the right place at the
right time with the right people. It's a formula that will deliver
extraordinary value to our customers, investors and employees
alike." |
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Company Profile
CSMC Technologies Corporation is a limited liability company
incorporated in the Cayman Islands. CSMC was listed on the main
board of The Stock Exchange of Hong Kong Limited in August 2004.
Pioneering the open foundry business model in China since 1997, CSMC
and its subsidiaries (the “Group”) own and operate the first and one
of the largest open semiconductor foundries in China as measured by
operational capacity. Our fabs are located in Wuxi, Jiangsu Province
and Beijing. We target the semiconductor market manufactured by
offering 3.0 micron to 0.35 micron foundry process technologies on
6-inch wafers, mainly focused on providing manufacturing services to
integrated circuits design houses for three types of applications,
including consumer electronics, communication, and computers. We
also provide manufacturing services for leading international
Integrated Device Manufacturers, utilizing our manufacturing
capacities for their proprietary process technologies. Our
manufacturing processes include CMOS logic, mixed-signal, high
voltage, non-volatile memory, electrically erasable programmable
read-only memory ICs and DMOS. Mixed-signal ICs and DMOS are widely
used for applications of power management IC and power discrete. We
also offer assistance to our customers by arranging upstream IC
design services as well as downstream testing and packaging
services.
We continue to expand our production capacity to better serve both
the China semiconductor market and the growing outsourcing demands
from overseas IDMs and fabless customers. In October 2005, we signed
a co-operation agreement with Institution of Microelectronics of the
Chinese Academy of Science to form our Fab 3 in Beijing. Fab 3 has
been established for operation and has completed the facility
expansion program by end of June 2006 and started its qualification
and production ramp up. Fab 3 is expected to contribute a production
capacity of 20,000 6-inch wafers per month in 2007. This will
further strengthen the Group’s current leading position as the
largest 6-inch open foundry in China.
We continue our effort to explore the possibility with certain
technology partners to form a strategic partnership for Fab 2, the
Group’s initial 8-inch wafer Fab. Fab 2 will focus on 8-inch process
technologies ranging from 0.35 micron to 0.18 micron in continuing
our pursuit of serving the mainstream segment in the China
semiconductor market as it migrates towards advanced technologies.
Our 8-inch initiative will also strengthen migration options for
international customers who seek to outsource their production lines
later on.
We believe our leading position in the mainstream segment in the
China semiconductor market and the development of our key overseas
markets will underpin the future success of CSMC.
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