OverviewCSMC 0.13 micron process employs Aluminum interconnects and covers wide application from generic, mixed signal, RF and low power/low leakage requirement.
Our Mixed Signal/RF platform is based on our standard logic process to deliver a high performance, low cost solution for SoC designs.
Our comprehensive and complete standard cell libraries, IO, memories, spice models, PDK and other design kits will assist customers to design-in easily.
Key Features
- Foundry standard 0.13µm geometric rules and logic frontend process
- 1.2V core device with 2.5V or 3.3V I/O transistor options (with foundry standard EDR specifications)
- Poly and 8 Al metal backend process
- L-shape Spacer and Co-salicidation process
- Reliable FSG dielectric based inter-metal process
- Mixed mode & RF devices available, eg. Middle VT, high poly resistor, MIM Capacitor, Varactor, Deep NWell, Native device, etc
- Special tailored for non-Cu users such as generic, low power, MS/RF, HV and CIS applications
Applications
- Applications such as USB, Audio, Video, WLAN, Bluetooth, 3G, Gigabit Ethernet, and portable communications devices