Mixed-Signal/RF-0.18um
 Overview
CSMC 0.18 micron process is process-matched to other foundry. CSMC logic process include Generic(G) and Low Power(LP). Each 0.18 micron process provide 1.8V operation voltage core device, 3.3V or 5V operation voltage IO device. 0.18 process option include native VT device, medium low VT device, isolation NMOS, MIM capacitor, high precision poly resistor, varactor and inductor.
Shrunk process is effective cost-down for customer and shrunk process provide device is very similar to non-shrunk process. 0.162 micron process is 90% shrunk of 0.18 micron process and 0.153 micron process is 85% shrunk of 0.18 micron process.
CSMC 0.18 micron process provide OTP/MTP process, OTP/MTP process no need extra mask layer.
 
 Key Features
    0.18G 0.18LP
Core Voltage Typical 1.8V 1.8V
Core Device Typical VT
Low VT  
IO Device 3.3V
5V
SRAM BItcell(um2)   4.65 4.65
     
  0.18um Process Family
    0.18G 0.18LP
Special Process Mix
RF
OTP/MTP  
Design Technical File
PDK
IP/Library
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