Mixed-Signal/RF
Based on CSMC logic process platforms, CSMC offers Mixed Signal and RFCMOS processes in 0.18µm/0.16µm/0.153µm and 0.13µm/0.11µm technology nodes. Our advanced Mixed Signal and RFCMOS processes deploy a number of performance-enhancing features including Deep N-well, multiple operating voltages (Vt), MIM capacitors, high poly resistors, (Ultra Thick Top Metal) Inductors, and Varactor. 
CSMC technology features and flexibility enable a high performance, low cost solution for integrated function designs.  Our design service tool kits include well characterized models, command files and RC extraction that ease schematic entry, simulation, layout generation, parameter extraction, and design rule validation.

CSMC's Mixed Signal and RFCMOS processes are fully compatible with industry standard CMOS logic technology.  Advanced CMOS technology expertise and quick turn manufacturing lead times enable fast time to market with optimum product solutions.  CSMC is able to meet customer high volume production requirements with our install Fab2 8-inch capacity and with ongoing capacity expansion programs. 

  0.13µm   0.18µm  
  0.13µm 1.2V/3.3V G
0.13µm 1.2V/3.3V LP
0.13µm 1.2V/3.3V MS
0.13µm 1.2V/3.3V RF

0.15µm LV
  0.18µm/0.16µm/0.153µm 1.8V/3.3V RF
0.18µm/0.16µm/0.153µm 1.8V/3.3V G
0.18µm/0.16µm/0.153µm 1.8V/3.3V LP
0.18µm/0.16µm/0.153µm 1.8V/3.3V MS
0.18µm/0.16µm/0.153µm 1.8V/5V G
0.18µm/0.16µm/0.153µm 1.8V/5V LP
0.18µm OTP
 
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